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News |
What's new with the HiJack project:
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Overview |
HiJack is a hardware/software platform for creating cubic-inch sensor peripherals for the mobile phone. HiJack devices harvest power and use bandwidth from the mobile phone's headset interface. The HiJack platform enables a new class of small and cheap phone-centric sensor peripherals that support plug-and-play operation. HiJack has been tested with the iPhone 3G/3GS/4G, iPod Touch, and iPad devices. Power. The HiJack energy harvester can supply 7.4 mW to a load with 47% power conversion efficiency when driven by a 22 kHz tone from the output from a single audio channel on the iPhone 3GS headset port, all using electronic components that cost just $2.34 in 10K volumes. We are exploring other approaches for achieving higher conversion efficiencies. Data. The HiJack communications layer offers two data transfer schemes. The first allows 300 baud data transfer using Bell 202 FSK signaling. The second offers 8.82 kbaud using a Manchester-encoded, direct-digital communication using hardware accelerators on the HiJack microcontroller and a software-defined, digital radio modulator/demodulator on the phone. The first scheme is described in the ISLPED'10 Design Contest entry (below). The second scheme is described in the DEV'10 paper below. Sensing. We envision a range of sensorboards including ozone, carbon monoxide, DVM, blood pressure, blood glucose, and others. But today, we only have four daughterboards: (1) a simple demo board with temperature/humidity sensors, PIR motion sensor, and potentiometer used on the early HiJack prototypes; (2) a 3-lead EKG sensor; (3) a basic soil moisture sensor; (4) a breakout board for fast prototyping on the latest generation of HiJacks. |
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Gallery |
Code
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The source code and schematics are available on Google Code: We currently have an example application for iOS, and are working on Android and Microsoft applications. The code for the microcontroller, a TI MSP430, is also available.
Availability
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HiJack hardware is available from Seeed Studio. |
If you are interested in getting a HiJack board for your own project, then please send us a short (1 page) proposal of your project idea. The project requirements:
We currently have 20 HiJacks available to give away. Depending on your project, we can also provide you with a programmer and a breakout board. Please email your project proposal to hijack.project@gmail.com. in PDF format, and don't forget to put your physical address and email on the top of your summary page.
Videos
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On Vimeo (Integrated). |
On Vimeo (Breadboard). On Vimeo (EKG Monitor). On Vimeo (Soil Moisture).
Demos
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At Mobicom'10 in Chicago. |
At Sensys'10 in Zurich. At DEV'10 in London. At IPSN'12 in Beijing.
Publications
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Sonal Verma, Andrew Robinson, and Prabal Dutta,
AudioDAQ:
Turning the Mobile Phone's Ubiquitous Headset Port into a
Universal Data Acquisition Interface, Sensys'12:
Proceedings of the 10th ACM Conference on Embedded Networked
Sensor Systems, Nov 2012.
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Prabal Dutta, Sustainable Sensing for a Smarter Planet, XRDS: Crossroads: The ACM Magazine for Students, Summer 2011, Vol. 17, No. 4, pgs 14-20, 2011. Ye-Sheng Kuo, Sonal Verma, Thomas Schmid, and Prabal Dutta, "Hijacking Power and Bandwidth from the Mobile Phone's Audio Interface", First Annual Symposium on Computing for Development (DEV'10), Dec. 2010. Ye-Sheng Kuo, Thomas Schmid, and Prabal Dutta, "Hijacking Power and Bandwidth from the Mobile Phone's Audio Interface", International Symposium on Low Power Electronics and Design (ISLPED'10) Design Contest, Aug. 2010. First Place Award.
People
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Andrew Robinson |
Brad Campbell Ye-Sheng Kuo Sonal Verma Thomas Schmid (Faculty) Prabal Dutta (Faculty)
Press
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Support
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CSE Division |
EECS Department University of Michigan 2260 Hayward Street Ann Arbor, Michigan 48109 |