Adam Peczalski

Adam Peczalski

Email: peczalsk@umich.edu
Office: 2338 EECS
Telephone: 734-647-1782

Biography
Adam Peczalski received his B.S. degree from the University of Wisconsin - Madison in 2011 in Electrical Engineering. He is currently working towards his Ph.D. in Electrical Engineering from the University of Michigan - Ann Arbor. His research interests include MEMS-CMOS integration, MEMS fabrication techniques, and MEMS resonators.He is a 3times recipient of Michigan Space Grant Consortium fellowship.

Publications
A. Peczalski, Z. Wu, R. Tabrizian, and M. Rais-Zadeh, “Investigation into the quality factor of piezoelectric-on-silica micromachined resonators,” IEEE Journal of Microelectromechanical Systems, 2015.

A. Peczalski and M. Rais-Zadeh, "Temperature compensated fused silica resonators using embedded nickel trenches," International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), accepted, Anchorage, Alaska, June, 2015.

Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Low-power ovenization of fused silica resonators for temperature-stable oscillators," IEEE International Frequency Control Symposium, Taipei, Taiwan, pp. 1-4, May, 2014.

Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Device-layer ovenization of fused silica micromechanical resonators for temperature-stable operation," Solid-State Sensors, Actuators and Microsystems Workshop, Hilton Head, SC, pp. 87-90, June, 2014.

Z. Wu, A. Peczalski, V. Thakar, and M. Rais-Zadeh, "A low phase-noise Pierce oscillator using a piezoelectric-on-silica micromechanical resonator," 17th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), best poster award, June, 2013.

V. A. Thakar, Z. Z. Wu, A. Peczalski, and M. Rais-Zadeh, "Piezoelectrically transduced temperature-compensated flexural-mode silicon resonators," IEEE Journal of Microelectromechanical Systems,June 2013.

Z. Wu, A. Peczalski, V. A. Thakar, Z. Cao, Y. Yuan, G. He, R. L. Peterson, K. Najafi, and M. Rais-Zadeh, "Piezoelectrically transduced high-Q silica micro resonators," IEEE International Conference on Microelectromechanical Systems (MEMS), Taipei, Taiwan, pp. 122-125, Jan, 2013.

M. Rais-Zadeh, V. A. Thakar, Z. Wu, and A. Peczalski, "Temperature compensated silicon resonators for space applications," SPIE Photonics West, MOEMS-MEMS, Invited, Feb, 2013.

M. Raieszadeh, Z. Wu, V. A. Thakar, A. Peczalski, "TCF compensated micromechanical resonators," Patent Filed 10/31/2012, U. of Michigan, 2012.

 

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